Integrated circuit having micro-etched channels

An electronic device assembly comprising:

• a printed circuit board;
• an integrated circuit attached to the printed circuit board, the integrated circuit including:
• a lead frame having electrically conductive contact terminal pads;
• a die centrally disposed in the lead frame;
• wire bonds electrically connecting the die to the electrically conductive terminal pads;
• a mold compound encapsulating the die and the wire bonds, a bottom surface of the mold compound being flush with a bottom surface of the contact terminal pads;
• and
• a channel defined in the bottom surface of the mold compound around a periphery of the contact terminal pads;
• and
• an under-fill material disposed between the bottom surface of the mold compound and a top surface of the printed circuit board, wherein the under-fill material is disposed in the channels.

A method comprising:

• providing a lead frame having leads and a die pad, the die pad being centrally disposed in the lead frame;
• attaching a die to a top planar surface of the die pad via a die attach;
• attaching wire bonds from the die to the leads;
• forming a mold compound over the lead frame, the die, and the wire bonds to form an integrated circuit, the leads having contact terminal pads exposed on a bottom surface of the mold compound, wherein the contact terminal pads are substantially flush with the bottom surface of the mold compound;
• and
• etching a channel on the bottom surface of the mold compound and around a periphery of the contact terminal pads, the channels configured to receive an under-fill material.