Side-filling resin composition, semiconductor device, and method for removing side-filling member
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsYusuke FUKAMOTO, Yasushi YAMADA, Yasuaki MAEDA
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Abstract
A side-filling resin composition is used to form a side-filling member to be interposed between a base member and a peripheral edge portion of a surface, facing the base member, of a mounted component that is surface-mounted on the base member. The side-filling resin composition has photocurability.
Claims7
A side-filling resin composition for use to form a side-filling member to be interposed between a base member and a peripheral edge portion of a surface, facing the base member, of a mounted component that is surface-mounted on the base member, the side-filling resin composition having photocurability.
Dependencies are inferred from the claim text.