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US 2023/0054940 A1Published application
Method of forming patterned features
AssigneeASM IP Holding B.V.
InventorYoann Tomczak
Life of this patent
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Abstract
Methods of forming patterned features and structures including the patterned features are disclosed. Exemplary methods include selectively forming a surface energy modified surface on a sidewall of structures and/or forming a surface-energy tunable layer on a surface of the substrate. The surface energy modified surface can be formed by depositing material and/or by treating the sidewall surface and/or by treating a surface adjacent the sidewall surface.
Claims20
A method of forming patterned features, the method comprising the steps of:
- providing a substrate comprising an underlayer and patterned structures on a surface of the substrate;
- selectively forming a surface-energy modified layer on sidewalls of the patterned structures;
- and
- depositing directed self-assembly material onto the substrate,
- wherein the surface-energy modified layer facilitates orientation of one or more of first and second components of the directed self-assembly material.
2 more elements
A method of forming patterned features, the method comprising the steps of:
- providing a substrate;
- forming a surface-energy tunable layer on a surface of the substrate;
- exposing a first portion of the surface-energy tunable layer to one or more of radiation and excited species to alter a surface energy of the first portion relative to a surface energy of a second portion of the surface-energy tunable layer;
- and
- depositing directed self-assembly material, comprising first components and second components, onto the substrate,
- wherein one or more of the first portion and the second portion facilitate orientation of one or more of first and second components of the directed self-assembly material.
3 more elements
Dependencies are inferred from the claim text.