US 2023/0054858 A1Published application

Apparatus and method for transferring wafer, and apparatus for controlling transferring wafer

AssigneeChangxin Memory Technologies, Inc.

InventorFencheng Zheng

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Abstract

The present disclosure provides an apparatus and a method for transferring a wafer, and an apparatus for controlling transferring a wafer. The apparatus for transferring a wafer includes a transfer chamber, at least one process chamber, a first detection unit, and a control unit, wherein the transfer chamber is provided therein with a transfer unit; the at least one process chamber is in connect with the transfer chamber, and a chamber door is provided at a connect position; the first detection unit includes a first transmit end and a first receive end, the first transmit end is provided on one of the transfer unit and the chamber door, and the first transmit end is provided on the other one of the transfer unit and the chamber door.

Claims17

Dependent claims

An apparatus for transferring a wafer, comprising:

a transfer chamber, the transfer chamber being provided therein with a transfer unit configured to transfer a wafer;
at least one process chamber, configured for process processing of the wafer, the at least one process chamber being in connect with the transfer chamber, and a chamber door being provided at a connect position;
a first detection unit, configured to detect position information between the transfer unit and the chamber door, and the first detection unit comprising a first transmit end and a first receive end, wherein the first transmit end is provided on one of the transfer unit and the chamber door, and the first receive end is provided on the other one of the transfer unit and the chamber door;
and
a control unit, electrically connected to the first detection unit, the transfer unit, and the chamber door separately, the control unit being configured to determine the position information between the transfer unit and the chamber door, control the transfer unit to move, and control the chamber door to open or close.

2 more elements

A method for transferring a wafer, applied in a process of transferring a wafer between a process chamber and a transfer chamber by an apparatus for transferring a wafer, comprising:

obtaining position information between a transfer unit and a chamber door of the apparatus for transferring a wafer;
obtaining preset position information, the preset position information being used to represent a position where the transfer unit will transfer the wafer without interfering with the process chamber;
and
controlling the chamber door to open when the position information is consistent with the preset position information.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 17/648,452Filed 20 Jan 2022
Priority: CN 202110943242.417 Aug 2021
Published: 23 Feb 2023
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

H10P 72/3302
Into and out of processing chamber: mechanical parts of transfer devices
H10P 72/50
Handling or holding of wafers, substrates or devices during manufacture or treatment thereof: for positioning, orientation or alignment
H10P 72/0454
Characterised by the layout of the process chambers: surrounding a central transfer chamber
H10P 72/0608
Position monitoring, e.g. misposition detection or presence detection: of substrates stored in a container, a magazine, a carrier, a boat or the like

Family

Application17/648,452Continuation
US 12,176,233 B2Related patent
US 2023/0054858 A1This patent

From the US filing history. Foreign family members aren’t listed.

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