Laminated Component Carrier With a Thermoplastic Structure
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorThomas KRIVEC
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Abstract
A component carrier for carrying at least one electronic component includes (a) a plurality of electrically conductive layers; (b) a plurality of electrically insulating layers; and (c) a thermoplastic structure. The electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate. Further, a method for manufacturing such a component carrier and an electronic apparatus including such a component carrier are provided.
Claims16
A component carrier for carrying at least one electronic component, the component carrier comprising:
- a plurality of electrically conductive layers,
- a plurality of electrically insulating layers forming thermosetting structures, and
- a thermoplastic structure comprising a thermoplastic material;
- wherein the electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate,
- wherein the thermosetting structure comprises a thermosetting material;
- wherein the thermosetting structure is formed over and/or under the thermoplastic structure, and
- wherein, with respect to a main plane being oriented parallel to the layers of the laminate, the thermosetting structure comprises a smaller size than the thermoplastic structure.
An electronic apparatus, comprising:
- a component carrier including:
- a plurality of electrically conductive layers,
- a plurality of electrically insulating layers forming thermosetting structures, and
- a thermoplastic structure comprising a thermoplastic material;
- wherein the electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate,
- wherein the thermosetting structure comprises a thermosetting material;
- wherein the thermosetting structure is formed over and/or under the thermoplastic structure, and
- wherein, with respect to a main plane being oriented parallel to the layers of the laminate, the thermosetting structure comprises a smaller size than the thermoplastic structure.
A method for manufacturing a component carrier, the method comprising:
- forming a laminated stack including a plurality of electrically conductive layers, a plurality of electrically insulating layers forming thermosetting structures, and a thermoplastic structure comprising a thermoplastic material,
- wherein the thermosetting structure comprises a thermosetting material over and/or under the thermoplastic structure,
- wherein, with respect to a main plane being oriented parallel to the layers of the laminate, the thermosetting structure comprises a smaller size than the thermoplastic structure,
- wherein within the main plane there is at least one exposed portion in which only the thermoplastic structure and not the thermosetting structure is provided.
Dependencies are inferred from the claim text.