Film deposition method and film deposition apparatus

A film deposition apparatus, configured to execute a film deposition method, wherein

• the film deposition method comprises:
• putting a substrate into a furnace tube, the furnace tube comprising a first section for placing the substrate, the first section having an inlet for reaction gas;
• heating, within a first preset time, a first heating module from a first initial temperature to a first preset temperature, the first heating module surrounding the first section and being configured to heat the first section;
• maintaining, within a second preset time, the first heating module continuously at the first preset temperature;
• and
• within a third preset time, introducing the reaction gas into the furnace tube from the inlet, and heating the first heating module from the first preset temperature to a second preset temperature so as to form a target film on a surface of the substrate placed in the first section;
• and
• the film deposition apparatus comprises:
• a furnace tube, comprising a first section for placing a substrate, the first section having an inlet for reaction gas;
• a first heating module, surrounding the first section and being configured to heat the first section;
• a gas source, configured to supply reaction gas;
• and
• a control module, electrically connected to the first heating module and the gas source, and configured to control the first heating module and the gas source;
• wherein, under the control of the control module, within a first preset time, the first heating module is heated from a first initial temperature to a first preset temperature;
• within a second preset time, the first heating module is maintained continuously at the first preset temperature;
• within a third preset time, the reaction gas is introduced into the furnace tube from the inlet, and the first heating module is heated from the first preset temperature to a second preset temperature.