Power semiconductor module with rivet or press fit pin and method for fabricating the same

A power semiconductor module, comprising:

• a first substrate and a second substrate;
• at least one power semiconductor die arranged between and thermally coupled to a first side of the first substrate and a first side of the second substrate, the at least one power semiconductor die being electrically coupled to the first side of the first substrate;
• at least one press fit pin arranged on and electrically coupled to the first side of the first substrate;
• and
• an encapsulant encapsulating the at least one power semiconductor die, the at least one press fit pin and the first and second substrates,
• wherein at least parts of a second side of the first substrate opposing the first side of the first substrate and at least parts of a second side of the second substrate opposing the first side of the second substrate are exposed from the encapsulant,
• wherein an external part of the at least one press fit pin is exposed from the encapsulant to form an external contact of the power semiconductor module.

A method for fabricating a power semiconductor module, the method comprising:

• providing a first substrate and a second substrate;
• arranging at least one power semiconductor die between a first side of the first substrate and a first side of the second substrate and thermally coupling the at least one power semiconductor die to the first and second substrates;
• electrically coupling the at least one power semiconductor die to the first substrate;
• arranging at least one rivet or at least one press fit pin on the first side of the first substrate and electrically coupling the at least one rivet or at least one press fit pin to the first side of the first substrate;
• and
• encapsulating the at least one power semiconductor die, the at least one rivet or the at least one press fit pin and the first and second substrates with an encapsulant such that at least parts of a second side of the first substrate opposing the first side of the first substrate and at least parts of a second side of the second substrate opposing the first side of the second substrate are exposed from the encapsulant, and such that the at least one rivet or the at least one press fit pin is exposed at the encapsulant to form an external contact of the power semiconductor module.