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US 2023/0054800 A1Published application
Wafer
AssigneeShinko Electric Industries Co., Ltd.
InventorKengo YAMAMOTO
Life of this patent
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Abstract
A wafer includes a substrate and conductive bumps on a surface of the substrate. In a plan view from a direction perpendicular to the surface of the substrate, the area density of the conductive bumps is higher in a first area than in a second area around the first area in the surface of the substrate. The first area has effective chip areas arranged therein.
Claims12
A wafer comprising:
- a substrate;
- and
- a plurality of conductive bumps on a surface of the substrate,
- wherein, in a plan view from a direction perpendicular to said surface of the substrate, an area density of the conductive bumps is higher in a first area than in a second area around the first area in said surface of the substrate, the first area having a plurality of effective chip areas arranged therein.
1 more element
Dependencies are inferred from the claim text.