Surface acoustic wave (saw) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods

A surface acoustic wave (SAW) filter package, comprising:

• a substrate comprising a piezoelectric material and having a first surface;
• a cap substrate;
• a cavity frame having a thermal conductivity of at least five (5) Watts (W) per meter (m)-Kelvin (W/m-K), the cavity frame disposed between the substrate and the cap substrate that forms a cavity between the cap substrate and the first surface of the substrate;
• a first interdigital transducer (IDT) on the first surface of the substrate inside the cavity;
• and
• a second IDT on the first surface of the substrate inside the cavity.

A method of fabricating a surface acoustic wave (SAW) filter package, comprising:

• providing a cap substrate comprising a first surface;
• coupling a first surface of a cavity frame to the cap substrate, the cavity frame having a thermal conductivity of at least five (5) Watts (W) per meter (m)-Kelvin (W/m-K);
• providing a substrate comprising a piezoelectric material, a first surface, a first interdigital transducer (IDT) on the first surface of the substrate, and a second IDT on the first surface of the substrate;
• and
• coupling a second surface of the cavity frame to the first surface of the substrate thereby forming a cavity between the cap substrate and the first surface of the substrate and enclosing the first IDT and the second IDT.