Apparatus including integrated segments and methods of manufacturing the same

A semiconductor device, comprising:

• a wafer-level substrate;
• active circuitry formed on the wafer-level substrate;
• a passivation layer over a surface of the wafer-level substrate;
• and
• an interfacing segment embedded within the passivation layer, wherein
• the interfacing segment includes electrical isolative material,
• the interfacing segment and the passivation layer include different material, and
• the interfacing segment and the passivation layer are coplanar with each other;
• an electrical pad physically coupled to the semiconductor substrate and electrically coupled to the active circuitry, wherein the electrical pad is configured to provide an external electrical interface for the active circuitry in the semiconductor device;
• and
• a thermal pad physically coupled to the interfacing segment and electrically isolated from the active circuitry, wherein the thermal pad is configured to provide an external thermal interface for removing thermal energy from the semiconductor device.

A method of manufacturing a semiconductor device, the method comprising:

• providing a semiconductor substrate having active circuitry thereon;
• forming an interfacing structure over the semiconductor substrate;
• forming one or more interfacing segments based on removing portions of the interfacing structure;
• forming a passivation layer over the semiconductor substrate and surrounding the one or more interfacing segments;
• and
• planarizing the passivation layer and the interfacing segments, wherein the planarized passivation layer and the interfacing segments have coplanar outer surfaces.