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US 2023/0054423 A1Published application
Abrasive and Method for Planarization Using the Same
AssigneesOci Company Ltd., Research & Business Foundation Sungkyunkwan University
InventorsYounghun Park, Eungchul Kim, Taesung Kim, Sangyup Lee, Kyungyeol Kim, Hwisu Oh
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Abstract
The present invention relates to an abrasive and a planarization method using the same, and more particularly, includes fumed silica. A BET specific surface area of the fumed silica is 200 m2/g to 450 m2/g, a shape of aggregates dispersed in the abrasive has an elongated shape or a round shape, and a ratio of the round shape of the aggregates is 50% to 90%.
Claims13
An abrasive for a CMP comprising fumed silica,
- wherein a BET specific surface area of the fumed silica is 200 m2/g to 450 m2/g,
- wherein a shape of aggregates dispersed in the abrasive has an elongated shape or a round shape, and
- wherein a ratio of the round shape of the aggregates is 50% to 90%.
Dependencies are inferred from the claim text.