Delayed adhesive activation
AssigneeLenovo (Singapore) Pte. Ltd.
InventorsBouziane Yebka, Tin-Lup Wong, Philip J. Jakes
Life of this patent
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Abstract
Apparatuses, methods, and systems are disclosed for an adhesive including an activated portion and an unactivated portion. The adhesive is interposed between and binds the first substrate to a second substrate. The unactivated portion includes moisture, and the activated portion is activated to adhere in response to the removal of moisture. Similarly, the unactivated portion of the adhesive may be activated in response to the removal of moisture, removal of air, applying radiation, heating, and/or catalyzing a functional group.
Claims26
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A method of joining first substrates, the method comprising:
- aligning a deactivated adhesive between a first substrate and a second substrate;
- activating a portion of the deactivated adhesive between the first substrate and the second substrate in response to removal of moisture, removal of air, applying radiation, or catalyzing a functional group;
- and
- forming a bond between the first substrate and the second substrate in response to the portion of the adhesive that is activated, wherein the activated portion surrounds an unactivated portion of the adhesive.
A method of bonding substrates, comprising:
- coating a first substrate or a binder with a first deactivated adhesive;
- coating a second substrate or the binder with a second deactivated adhesive;
- aligning the first substrate relative to the second substrate about the binder interposed between the first substrate and the second substrate;
- activating a portion of the first deactivated adhesive in response to removal of moisture;
- and
- activating a portion of the second deactivated adhesive in response to removal of air, applying radiation, or catalyzing a functional group.
An apparatus comprising:
- a first substrate;
- a second substrate;
- a deactivated adhesive aligned between the first substrate and the second substrate, wherein:
- a portion of the deactivated adhesive is activated between the first substrate and the second substrate in response to removal of moisture, removal of air, applying radiation, or catalyzing a functional group;
- and
- a bond is formed between the first substrate and the second substrate in response to the portion of the adhesive that is activated, wherein the activated portion surrounds an unactivated portion of the adhesive.
Dependencies are inferred from the claim text.