Back to results
US 2023/0054092 A1Published application
Sensor module
AssigneeSony Semiconductor Solutions Corporation
InventorYUTARO YAMASHITA
Life of this patent
Estimating the term…
Abstract
A sensor module includes a housing, a board unit, an external connector, and a joining member. The housing includes a first case, and a second case that is welded to the first case. The board unit includes a sensor element, and is arranged in the housing. The external connector is provided to the second case, and includes an elastically deformable terminal that is electrically connected to the board unit. The joining member is mounted on the board unit and welded to the housing.
Claims16
A sensor module, comprising:
- a housing that includes a first case, and a second case that is welded to the first case;
- a board unit that includes a sensor element, and is arranged in the housing;
- an external connector that is provided to the second case, and includes an elastically deformable terminal that is electrically connected to the board unit;
- and
- a joining member that is mounted on the board unit and welded to the housing.
2 more elements
Dependencies are inferred from the claim text.