Package structure and method for manufacturing the same

A package structure, comprising:

• a circuit board including a substrate and a first electronic element disposed on the substrate;
• a mold sealing layer disposed on the substrate and covering the first electronic element, the mold sealing layer having a top surface, a bottom surface corresponding to the top surface, and a side surface connected between the top surface and the bottom surface;
• a conductive metal board disposed on the top surface and adjacent to the first electronic element;
• and
• a conductive layer disposed on the side surface;
• wherein the conductive metal board and the conductive layer are each an independent component;
• wherein the conductive metal board has a top face, a bottom face corresponding to the top face, and a side face connected between the top face and the bottom face;
• wherein the circuit board further includes a conductive ground element embedded into the substrate;
• wherein the conductive ground element has an exposed surface for which the substrate is exposed, the conductive layer simultaneously abuts against the side surface, the side face, at least a portion of the top face, and the exposed surface, and the conductive layer is electrically connected to the conductive metal board and the conductive ground element.