Back to results
US 2023/0053559 A1Published application
Lead frame and electronic component
AssigneeTDK Corporation
InventorsKazuma YAMAWAKI, Shuhei MIYAZAKI
Life of this patent
Estimating the term…
Abstract
A lead frame includes a die pad, a plurality of leads, a frame member, and at least one wire. The frame member includes two first connection bars and two second connection bars. The plurality of leads include a plurality of specific leads. Each of the specific leads is connected to the first connection bar. At least one of the specific leads is connected to the second connection bar via the at least one wire.
Claims14
A lead frame for an electronic component, comprising
- a die pad;
- a plurality of leads;
- a frame member configured to surround the die pad and the plurality of leads;
- and
- at least one wire, wherein
- the frame member includes a first connection bar extending in a first direction and a second connection bar extending in a second direction,
- the plurality of leads include a plurality of specific leads arranged along the first connection bar,
- the plurality of specific leads are each connected to the first connection bar, and
- at least one of the specific leads is connected to the second connection bar via the at least one wire.
6 more elements
Dependencies are inferred from the claim text.