Silicon carbide semiconductor device and power conversion apparatus
AssigneeMitsubishi Electric Corporation
InventorsKatsuhiro FUJIYOSHI, Toshikazu TANIOKA
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AssigneeMitsubishi Electric Corporation
InventorsKatsuhiro FUJIYOSHI, Toshikazu TANIOKA
Estimating the term…
A silicon carbide semiconductor device includes an n-type epitaxial layer provided on a SiC substrate, a front surface electrode provided on the epitaxial layer, and a p-type electric field relieving region provided in the upper layer of the epitaxial layer in a terminal region. On the epitaxial layer, a first protective film composed of an interlayer insulating film and a protective oxide film that covers at least a part of the electric field relieving region is provided. A second protective film composed of a polyimide protective film is provided via a silicon nitride film so as to cover the outer end portion of the surface electrode, the first protective film, and at least a part of the epitaxial layer. The silicon nitride film protrudes from the second protective film at both an inner side end portion and an outer side end portion.
A silicon carbide semiconductor device comprising:
Dependencies are inferred from the claim text.