Conductive bonding material, bonding member including the conductive bonding material, and bonding method

Abstract

A bonding method in which applied is a prescribed conductive bonding material, which contains a molded article of a metal powder. The metal powder is one or more selected from the group consisting of a gold powder, a silver powder, a platinum powder, and a palladium powder, and has a purity of 99.9% by mass or more, and an average particle size of 0.005 µm to 1.0 µm, and the conductive bonding material has a compressive deformation rate M, represented by the following expression, of 5 % or more and 30% or less when compressed with a compression pressure of 5 MPa. [Expression 1] M = {(h1 - h2)/h1} x 100, wherein h1 represents an average thickness of the conductive bonding material before compression, and h2 represents an average thickness of the conductive bonding material after the compression.

Dependencies are inferred from the claim text.