US 2023/0030440 A1 · OVERMOLDED TRANSPARENT STRUCTURE

Abstract

A transparent injection overmolded structure (100) encapsulating a real botanical matter (70) including at least one first transparent multilayer film member (50), at least one second transparent multilayer film member (60), a real botanical matter (70) disposed and encapsulated between the surface of the first transparent multilayer film member (50) and the surface of the second transparent multilayer film member (60) forming an integral transparent multilayered encapsulation structure (30), a base member (40) for receiving and attaching to the transparent multi-layered encapsulation structure (30), and an injection overmolded transparent plastic member (20) integral with and enveloping the base member (40) and the transparent multilayered encapsulation structure (30). Wherein the at least one first transparent multilayer film (50) member includes at least one low-seal initiation temperature inner layer (51) for contacting a botanical matter (70), at least one outer bonding layer (52) for contacting and bonding to an injection overmolded transparent plastic member (20), and at least one core barrier layer (53) interposed between the inner layer (51) and outer layer (52); wherein the at least one second transparent multilayer film member (60) includes at least one low-seal initiation temperature inner layer (61) for contacting a botanical matter (70), at least one outer bonding layer (62) for contacting and bonding to an injection overmolded transparent plastic member (20), and at least one core barrier layer (63) interposed between the inner layer (61) and outer layer (62). A process for producing the transparent injection overmolded structure (100) encapsulating a real botanical matter (70) is also disclosed.

Claims11

Dependent claims

A transparent injection overmolded structure encapsulating a real botanical matter comprising:

(a) at least one first transparent multilayer film member;
wherein the at least one first transparent multilayer barrier film member includes:
(i) at least one low-seal initiation temperature inner layer for contacting a botanical matter;
(ii) at least one outer bonding layer for contacting and bonding to an injection overmolded transparent plastic member;
and
(iii) at least one core barrier layer interposed between the inner layer and the outer layer;
(b) at least one second transparent multilayer film member;
wherein the at least one second transparent multilayer barrier film member includes:
(i) at least one low-seal initiation temperature inner layer for contacting a botanical matter;
(ii) at least one outer bonding layer for contacting and bonding to an injection overmolded transparent plastic member;
and
(iii) at least one core barrier layer interposed between the inner inlayer and the outer layer;
(c) a real botanical matter disposed and sandwiched inbetween the surface of the at least one low-seal initiation temperature inner layer of the first transparent multilayer film member and the surface of the at least one low-seal initiation temperature inner layer of the second transparent multilayer film member forming an integral transparent multilayered encapsulation structure;
(d) a base member for receiving and attaching to the transparent multilayered encapsulation structure of component (c);
and
(e) an injection overmolded transparent plastic member integral with, and enveloping, the base member of component (d) and the transparent multilayered encapsulation structure of component (c) to form an overmolded transparent part encapsulating a real botanical matter inside the part.

13 more elements

An injection overmolding process for encapsulating botanical matter comprising the steps of:

(A) providing a real botanical matter;
(B) providing at least one first transparent multilayer film member;
wherein the at least one first transparent multilayer barrier film member includes:
(i) at least one low-seal initiation temperature inner layer for contacting the botanical matter;
(ii) at least one outer bonding layer for contacting and bonding to an injection overmolded transparent plastic member;
and
(iii) at least one core barrier layer interposed between the inner layer and the outer layer;
(C) providing at least one second transparent multilayer film member;
wherein the at least one second transparent multilayer barrier film member includes:
(i) at least one low-seal initiation temperature inner layer for contacting the botanical matter;
(ii) at least one outer bonding layer for contacting and bonding to an injection overmolded transparent plastic member;
and
(iii) at least one core barrier layer interposed between the inner layer and the outer layer;
(D) interposing and sandwiching the real botanical matter inbetween the surface of the at least one low-seal initiation temperature inner layer of the first transparent multilayer film member and the surface of the at least one low-seal initiation temperature inner layer of the second transparent multilayer film member;
(E) encapsulating the real botanical matter sandwiched inbetween the first transparent multilayer film member and the second transparent multilayer film member forming an integral transparent multilayered encapsulation structure;
(F) providing a base member for receiving and attaching to the transparent multilayered encapsulation structure of step (E);
(G) attaching the transparent multilayered encapsulation structure of step (E) onto the surface of the base member of step (F);
(H) placing the combination of the transparent multilayered encapsulation structure attached to the surface of the base member of step (G) into an injection mold;
and
(I) overmolding, by injection molding, a transparent plastic member onto the combination of the base member and the transparent multilayered encapsulation structure attached to the surface of the base member positioned in the injection mold of step (H) to form an overmolded transparent part encapsulating a real botanical matter inside the part.

17 more elements

Dependencies are inferred from the claim text.

Overmolded transparent structure

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Overmolded transparent structure

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Abstract

Claims11