Adhesive film for polishing pad, laminated polishing pad including the same and method of polishing wafer
AssigneeSKC solmics Co., Ltd.
InventorsJung Nam LEE, Sunghoon YUN, Jangwon SEO
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Abstract
An adhesive film for a polishing pad including a plurality of through holes extended from a top surface to a bottom surface of the adhesive film, wherein a volume fraction of the plurality of through holes is 3% to 20% based on a total volume of the adhesive film, is disclosed.
Claims20
An adhesive film for a polishing pad comprising a plurality of through holes extended from a top surface to a bottom surface of the adhesive film, wherein a volume fraction of the plurality of through holes is 3% to 20% based on a total volume of the adhesive film.
A laminated polishing pad comprising:
- a polishing pad;
- and
- an adhesive film for the polishing pad attached to one surface of the polishing pad,
- wherein the polishing pad comprises a plurality of through holes extended from a top surface to a bottom surface of the adhesive film, and
- wherein a volume fraction of the plurality of through holes is 3% to 20% based on a total volume of the adhesive film.
A method of polishing a wafer comprising:
- preparing a laminated polishing pad attached to a plate and a polishing head, to which a wafer is fixed;
- and
- rotating any one or both of the plate and the polishing head, while contacting the wafer with the laminated polishing pad with adding slurry,
- wherein the laminated polishing pad comprises:
- a polishing pad;
- and
- an adhesive film for the polishing pad attached to one surface of the polishing pad,
- wherein the polishing pad comprises a plurality of through holes extended from a top surface to a bottom surface of the adhesive film, and
- wherein a volume fraction of the plurality of through holes is 3% to 20% based on a total volume of the adhesive film.
Dependencies are inferred from the claim text.