Back to results
US 2022/0363798 A1Published application
Resin composition, prepreg, resin-attached film, resin-attached metal foil, metal-cladded laminate sheet, and wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsTakahiro YAMADA, Hiroyuki FUJISAWA, Yuji YAMADA
Life of this patent
Estimating the term…
Abstract
A resin composition is provided and contains a maleimide compound, a polyphenylene ether compound having an unsaturated double bond in the molecule, a phosphorus-containing compound having a group represented by the following Formula (1) and a group containing a phosphorus atom in the molecule, and a curing agent. In Formula (1), R1 represents a hydrogen atom or an alkyl group.
Claims15
A resin composition comprising:
- a maleimide compound;
- a polyphenylene ether compound having an unsaturated double bond in a molecule;
- a phosphorus-containing compound having a group represented by the following Formula (1) and a group containing a phosphorus atom in a molecule;
- and
- a curing agent:
- [in Formula (1), R1 represents a hydrogen atom or an alkyl group].
3 more elements
Dependencies are inferred from the claim text.