Loading patent…
AssigneeKoenig & Bauer Aktiengesellschaft
InventorsThorsten HAAG, Elena LANG
Estimating the term…
In some examples, a processing machine has at least one cleaning device for cleaning a substrate. The at least one cleaning device and the at least one substrate are able to be arranged in a first and a second cleaning state, and the substrate is arranged at a distance from the at least one cleaning device in the first cleaning state. The substrate is arranged in contact with the at least one cleaning device in the second cleaning state, and the at least one cleaning device and the substrate are arranged so as to be transferable at least from the first cleaning state into the second cleaning state. The at least one cleaning device is arranged to be adjusted from a first cleaning position in the first cleaning state into a second cleaning position in the second cleaning state.
1-28. (canceled)
A processing machine (01) comprising at least one cleaning device (120) for cleaning a substrate (02), it being possible to arrange the at least one cleaning device (120) and the at least one substrate (02) in a first cleaning state, the at least one cleaning device comprising at least two flow elements (134) and/or brushes (133), in the first cleaning state the substrate (02) being arranged spaced apart from the at least one cleaning device (120), it being possible to arrange the at least one cleaning device (120) and the at least one substrate (02) in a second cleaning state, in the second cleaning state the substrate (02) being arranged so as to be in contact with the at least two flow elements (134) and/or the brushes (133) of the at least one cleaning device (120), and the at least one cleaning device (120) and the substrate (02) being arranged so as to be transferrable at least from the first cleaning state into the second cleaning state, the at least one cleaning device (120) being arranged so as to be displaced from a first cleaning position in the first cleaning state into a second cleaning position in the second cleaning state, in the first cleaning position the at least one cleaning device (120) being functionally connected to a cleaning region (127) on the substrate (02) and/or on the transport path intended for the substrate (02), and, in the second cleaning position of the at least one cleaning device (120), the cleaning region (127) being arranged so as to be shifted on the substrate (02) and/or on the transport path intended for the substrate (02), and, in the first cleaning state and in the second cleaning state, the at least one cleaning device (120) being arranged so as to apply a suction force at least onto the cleaning region (127).
A method for cleaning a substrate (02) in a processing machine (01), a distance between at least one cleaning device (120) and a substrate (02) being adjusted as a function of the substrate properties and/or as a function of the substrate format and/or as a function of a mode of operation of the processing machine (01), characterized in that, for setting the distance between the cleaning device (120) and the substrate (02), the cleaning device (120) is displaced, parallel to the substrate (02) and/or the transport path intended for the substrate (02), from a first cleaning state into a second cleaning state, and that, in the cleaning states, the cleaning device (120) applies a suction force onto the substrate (02).
Dependencies are inferred from the claim text.