US 2022/0287209 A1 · POWER ELECTRONICS MODULE AND METHOD FOR FABRICATING A POWER ELECTRONICS MODULE

Abstract

A power electronics module includes at least one first substrate having on a first side one or more first semiconductor dies, the one or more first semiconductor dies and the at least one first substrate providing a higher power part of the power electronics module, at least one second substrate having on a first side one or more second semiconductor dies, the one or more second semiconductor dies and the at least one second substrate providing a lower power part of the power electronics module, and a common frame at least partially encasing the first and second substrates and being a monobloc part, the higher power part being configured for direct liquid cooling and the lower power part being configured for indirect cooling.

Claims19

Dependent claims

A power electronics module, comprising:

at least one first substrate comprising on a first side one or more first semiconductor dies, the one or more first semiconductor dies and the at least one first substrate providing a higher power part of the power electronics module;
at least one second substrate comprising on a first side one or more second semiconductor dies, the one or more second semiconductor dies and the at least one second substrate providing a lower power part of the power electronics module;
and
a common frame at least partially encasing the at least one first substrate and the at least one second substrate and being a monobloc part,
wherein the higher power part is configured for direct liquid cooling and wherein the lower power part is configured for indirect cooling.

2 more elements

Dependencies are inferred from the claim text.

Power electronics module and method for fabricating a power electronics module

Life of this patent

Power electronics module and method for fabricating a power electronics module

Life of this patent

Abstract

Claims19