Method for electrically conductively contacting an optoelectronic component having at least one protective layer and optoelectronic component having a contacting of this type

A method for electrically conductively contacting an optoelectronic component having at least one protective layer comprising:

• a) providing the optoelectronic component having the at least one protective layer, wherein the optoelectronic component has at least one busbar arranged below the at least one protective layer,
• b) forming at least one opening by laser ablation using at least one laser beam in the at least one protective layer, wherein the wavelength range of the laser is 8 μm to 12 μm, wherein at least one busbar arranged below the at least one protective layer is partly exposed, such that the at least one busbar is not damaged,
• c) introducing a low-melting solder into the at least one opening of the at least one protective layer, and aligning and fixing an electrically conductive element that is flexible on a side of the at least one opening opposite the at least one busbar, and
• d) forming, by inductive soldering with a uniform heat input, an electrically conductive connection element in the at least one opening, such that the electrically conductive element and the at least one busbar are electrically conductively contacted via the at least one connection element.