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US 2022/0285599 A1Published application
Circuit board having multiple solder resists and displaying apparatus having the same
AssigneeSeoul Semiconductor Co., Ltd.
InventorsYoungsik KI, Seung Sik HONG
Life of this patent
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Abstract
A circuit board includes a base having a plurality of interconnections on an upper surface thereof, a first photosensitive solder resist (PSR) covering the interconnections and defining a pad open region exposing portions of the interconnections, a second PSR covering the first PSR and having an opening exposing the pad open region. The opening of the second PSR is larger than the pad open region of the first PSR.
Claims20
A circuit board, comprising:
- a base;
- a plurality of interconnections disposed on an upper surface of the base, each interconnection comprising a plurality of portions;
- a first photosensitive solder resist (PSR) covering a portion of each of the plurality of interconnections, the first PSR arranged to define a pad open region configured to expose a remainder portion of each of the plurality of interconnection;
- and
- a second PSR covering the first PSR and having an opening configured to expose the pad open region,
- wherein the opening of the second PSR is larger than the pad open region of the first PSR.
3 more elements
A displaying apparatus, comprising:
- a circuit board;
- a unit pixel disposed on the circuit board;
- and
- a molding member covering the unit pixel;
- the circuit board comprising:
- a base having a plurality of interconnections on an upper surface thereof;
- a first photosensitive solder resist (PSR) covering a portion of each of the plurality of interconnection, the first PSR arranged to define a pad open region configured to expose a remainder portion of each of the plurality of interconnections;
- and
- a second PSR covering the first PSR and having an opening configured to expose the pad open region, wherein:
- the opening of the second PSR is larger than the pad open region of the first PSR, and
- the unit pixel is disposed in the pad open region and in the opening of the second PSR such that the unit pixel is electrically coupled to the remainder portion of each of the plurality of interconnections in the pad open region.
8 more elements
A displaying apparatus, comprising:
- a panel substrate;
- a plurality of pixel modules arranged on the panel substrate, each pixel module comprising:
- a circuit board;
- a plurality of unit pixels disposed on the circuit board and including a selected unit pixel;
- and
- a molding member covering the plurality of unit pixels;
- wherein the circuit board further comprises:
- a base having a plurality of interconnections on an upper surface thereof, wherein an interconnection of the plurality of interconnections comprises a first part, a second part, and a third part;
- a pad open region formed in a first photosensitive solder resist (PSR) layer, the pad open region configured to expose the first part of the interconnection, and the first PSR layer covering the second part and the third part of the interconnection;
- and
- an opening formed in a second PSR layer covering a portion of the first PSR layer, the pad open region exposed in the opening of the second PSR layer;
- and
- wherein the selected unit pixel is disposed in the opening such that the selected unit pixel is electrically connected to the first part of the interconnection in the pad open region.
10 more elements
Dependencies are inferred from the claim text.