Semiconductor chip package and method of forming

A photovoltaic module, comprising a first substrate, a first encapsulating layer, a solar cell string, a second encapsulating layer, and a second substrate are stacked in sequence, wherein the solar cell string comprises:

• a first adhesive layer, wherein the first adhesive layer comprises N placement regions sequentially arranged along a first direction, and the N is a positive integer greater than 1;
• N solar cells, wherein each of the N solar cells is disposed on a corresponding placement region of the N placement regions;
• first wires, wherein the first wires are laid on a surface of at least one of the N solar cells away from the first adhesive layer, and the first wires stretch across adjacent placement regions to electrically connect adjacent solar cells;
• and
• a second adhesive layer, wherein the second adhesive layer is disposed on the surface of the at least one of the N solar cells away from the first adhesive layer, the first wires are located between the second adhesive layer and the at least one of the N solar cells, and the first adhesive layer, the first wires, the N solar cells, and the second adhesive layer are bonded and fixed.