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US 2022/0285550 A1Published application
Semiconductor Device Having Contact Trenches Extending from Opposite Sides of a Semiconductor Body
AssigneeInfineon Technologies AG
InventorsMarkus Zundel, Andreas Meiser, Hans-Peter Lang, Thorsten Meyer, Peter Irsigler
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Abstract
A method of manufacturing a semiconductor body includes forming a pattern at a first side of a substrate, forming a semiconductor layer on the first side of the substrate, attaching the substrate and the semiconductor layer to a carrier via a surface of the semiconductor layer, and removing the substrate from a second side opposite to the first side.
Claims12
A method of manufacturing a semiconductor body comprising:
- forming a pattern at a first side of a substrate;
- forming a semiconductor layer on the first side of the substrate;
- attaching the substrate and the semiconductor layer to a carrier via a surface of the semiconductor layer;
- and
- removing the substrate from a second side opposite to the first side.
2 more elements
Dependencies are inferred from the claim text.