Package structure and manufacturing method thereof

A package structure, comprising:

• a redistribution layer having a first surface and a second surface opposite to the first surface;
• an antenna substrate structure, disposed over the first surface of the redistribution layer and laterally wrapped by a first encapsulant, wherein the antenna substrate structure includes a first laminated layer, a core layer disposed on the first laminated layer, a second laminated layer disposed on the core layer, and the first laminated layer includes at least one antenna element;
• at least one integrated passive device, disposed over the second surface of the redistribution layer and encapsulated by a second encapsulant;
• a first semiconductor die and a second semiconductor die, disposed over the second surface of the redistribution layer and located between the at least one integrated passive device and the antenna substrate structure;
• and
• a connector, disposed over the second surface of the redistribution layer and located aside of the at least one integrated passive device,
• wherein a span of the second encapsulant is smaller than a span of the first encapsulant, the connector is located outside of the second encapsulant, and a portion of the second surface of the redistribution layer is exposed.

A method for forming a package structure, comprising:

• providing an antenna substrate structure having a circuit substrate and at least one antenna element inlaid in the circuit substrate;
• disposing the antenna substrate structure over a carrier, facing the at least one antenna element toward the carrier;
• molding the antenna substrate structure with a first encapsulant covering sidewalls of the antenna substrate structure;
• forming a redistribution layer on the molded antenna substrate structure and the first encapsulant;
• disposing a semiconductor die on the redistribution layer;
• and
• molding the semiconductor die with a second encapsulant,
• wherein the at least one antenna element is electrically coupled with the semiconductor die through the circuit substrate and the redistribution layer.