Semiconductor packages and methods for forming the same

A semiconductor package, comprising:

• a substrate;
• a first integrated circuit die attached to the substrate, wherein the first integrated circuit die has a first cutting surface;
• a second integrated circuit die attached to the substrate adjacent the first integrated circuit die, wherein the second integrated circuit die has a second cutting surface, and the first cutting surface faces the second cutting surface;
• and
• a plurality of inter-chip connectors formed between the first integrated circuit die and second integrated circuit die, wherein a first end of each of the inter-chip connector contacts the first cutting surface and a second end of the inter-chip connector contacts the second cutting surface.

A method for forming a semiconductor device, comprising:

• forming a first integrated circuit die having a first edge interconnect feature, and a second integrated circuit die having a second edge interconnect feature, wherein the first edge interconnect feature is exposed on a cutting surface of the first integrated circuit die, and the second edge interconnect feature is exposed on a cutting surface of the second integrated circuit die;
• positioning the first and second integrated circuit dies adjacent to each other such that the first edge conductive feature faces the second edge conductive feature;
• and
• forming an inter-chip connector between the first edge conductive feature and the second edge conductive feature.