Packaged memory device with flip chip and wire bond dies

A memory device, comprising:

• a substrate;
• a controller die attached and electrically connected to the substrate with a plurality of first solder balls;
• a flip chip die attached and electrically connected to the substrate, adjacent to the controller die, with a second plurality of solder balls, such that the flip chip die is in communication with the controller die by way of the substrate;
• and
• a plurality of silicon dies stacked one atop another in an offset manner, wherein a bottom one of the silicon dies is attached to one of a top surface of the flip chip die and the substrate, and wherein the plurality of silicon dies are electrically connected to the substrate with bond wires such that the plurality of silicon dies are in communication with the controller die by way of the substrate, and
• wherein the flip chip die and the plurality of silicon dies comprise NAND dies.

A method of assembling a memory device, the method comprising:

• attaching a controller die to a substrate;
• attaching a flip chip die to the substrate and adjacent to the controller die, wherein the flip chip die is in communication with the controller die by way of the substrate;
• attaching a bottom surface of a first silicon die to a top surface of the flip chip die, the first silicon die including a first contact pad surface opposite to its bottom surface;
• attaching a bottom surface of a second silicon die to the first contact pad surface of the first silicon die, the second silicon die including a second contact pad surface opposite its bottom surface;
• electrically connecting the first and second contact pad surfaces to the substrate with bond wires such that the first and second silicon dies are in communication with the controller die by way of the substrate.