Method for manufacturing a semiconductor package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorShun Sing LIAO
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a semiconductor package includes: (a) providing a substrate structure, wherein the substrate structure includes a chip attach area, a bottom area opposite to the chip attach area, a lower side rail surrounding the bottom area, a first lower structure and a second lower structure, wherein the first lower structure is disposed in a first lower region of the lower side rail, and a second lower occupancy ratio is greater than a first lower occupancy ratio; (b) attaching at least one semiconductor chip to the chip attach area; and (c) forming an encapsulant to cover the at least one semiconductor chip.
Claims20
A substrate structure comprising:
- a first lower structure disposed in a lower side rail;
- and
- a second lower structure disposed in the lower side rail,
- wherein a stress relieving ability of the first lower structure is greater than a stress relieving ability of the second lower structure, and a structural strength of the second lower structure is greater than a structural strength of the first lower structure.
A substrate structure comprising:
- a chip attach area;
- a first upper structure disposed in an upper side rail;
- a second upper structure disposed in the upper side rail;
- a first lower structure disposed in a lower side rail;
- and
- a second lower structure disposed in the lower side rail,
- wherein a stress relieving ability of the first lower structure is less than a stress relieving ability of the first upper structure, and a structural strength of the second lower structure is greater than a structural strength of the second upper structure.
A substrate structure comprising:
- an electronic component attach area;
- an upper structure disposed in an upper side rail;
- and
- a lower structure disposed in a bottom side rail,
- wherein the lower structure is configured to reduce a warpage of the substrate structure.
Dependencies are inferred from the claim text.