Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Ying-Jui Huang, Chih-Hang Tung, Tung-Liang Shao, Ching-Hua Hsieh, Chien Ling Hwang, Yi-Li Hsiao, Su-Chun Yang
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Abstract
A method includes picking up a first package component, removing an oxide layer on an electrical connector of the first package component, placing the first package component on a second package component after the oxide layer is removed, and bonding the first package component to the second package component.
Claims20
An apparatus configured to bond a first package component to a second package component, the apparatus comprising:
- a pickup module configured to pick up the first package component;
- a de-oxide module configured to remove an oxide layer from the first package component;
- an alignment module configured to align the first package component to the second package component;
- and
- a placement module configured to place the first package component on the second package component.
An apparatus configured to bond a first package component to a second package component, the apparatus comprising:
- a pickup head configured to:
- pick up the first package component;
- and
- transfer the first package component along a path connecting the first package component to the second package component;
- a plasma generator comprising an output device, wherein the output device is positioned at a location close to the path;
- and
- an alignment module configured to align the first package component to the second package component.
An apparatus configured to bond a first package component to a second package component, the apparatus comprising:
- a pickup head configured to pick up the first package component, and transfer the first package component along a path connecting the first package component to the second package component;
- a Radio-Frequency (RF) generator configured to generate a plasma;
- an output device connected to the RF generator, wherein the output device is configured to output the plasma;
- an alignment module configured to align the first package component to the second package component;
- and
- a controller signally connected to the pickup head, the RF generator, and the alignment module, wherein the controller is configured to control the pickup head and the output device to de-oxidize the first package component when the first package component is being transferred.
Dependencies are inferred from the claim text.