Variable stiffness modules

A method of making a variable-stiffness module, comprising:

• providing a rigid structure having a first stiffness;
• providing an intermediate substrate having a second stiffness less than the first stiffness;
• providing a flexible substrate having a third stiffness less than the second stiffness;
• disposing the rigid structure on the intermediate substrate and disposing the intermediate substrate on the flexible substrate;
• disposing a conductor partially on the intermediate substrate and partially on the flexible substrate;
• and
• connecting the rigid structure to the conductor so that the conductor extends from the rigid structure to the intermediate substrate to the flexible substrate.

A variable-stiffness module, comprising:

• a rigid structure having a first stiffness;
• a support structure having a variable stiffness, wherein a portion of the support structure has a local stiffness less than the first stiffness, wherein the rigid structure is disposed on the portion of the support structure;
• and
• a conductor disposed on the rigid structure and on the support structure, the conductor extending from the rigid structure to the support structure.

A variable-stiffness module, comprising:

• a rigid structure having a first stiffness;
• an intermediate substrate having a second stiffness less than the first stiffness, wherein the rigid structure is disposed on the intermediate substrate;
• a flexible substrate having a third stiffness less than the second stiffness, wherein the intermediate substrate is disposed on the flexible substrate;
• and
• a conductor disposed at least partially on the flexible substrate and connected to the rigid structure.

A module, comprising:

• a rigid structure having a first stiffness;
• an intermediate substrate having a second stiffness less than the first stiffness, wherein the rigid structure is disposed on the intermediate substrate;
• a flexible substrate having a third stiffness less than or equal to the second stiffness, wherein the intermediate substrate is disposed on the flexible substrate and the rigid structure is disposed at least partially between the intermediate substrate and the flexible substrate;
• and
• a conductor disposed at least partially on the flexible substrate and connected to the rigid structure.