Semiconductor device with a semiconductor chip connected in a flip chip manner

A semiconductor device comprising:

• a wiring board having a surface,
• a semiconductor chip having a functional surface,
• a connecting member provided between the surface of the wiring board and the functional surface of the semiconductor chip, the connecting member extending a distance between the surface of the wiring board and the functional surface of the semiconductor chip, and
• a sealing material that seals a gap space between the wiring board and the semiconductor chip,
• wherein a lateral distance between an edge of the semiconductor chip and an edge of the sealing material is longer than 0.1 mm,
• wherein the wiring board includes an insulating pattern provided on the surface thereof, the insulating pattern having a first edge between the edge of the semiconductor chip and an edge of the wiring board, and
• wherein the surface of the wiring board between the edge of the wiring board and the first edge is exposed from the insulating pattern.