Integrated system-in-package with radiation shielding

A method of forming a system in a package (SIP), comprising:

• providing carrier layer regions that comprises a dielectric material with at least one metal post through a thickness of the carrier layer region, adjacent ones of the carrier layer regions defining a gap having dimensions sufficient for placement of a driver integrated circuit (IC) die within the gap;
• positioning the driver IC die within the gap, the driver IC die comprising a substrate having circuitry configured for a function with nodes connected to bond pads exposed by openings in a top side of a first passivation layer, wherein the driver IC die is positioned with the bond pads facing up;
• forming a dielectric layer on the first passivation layer and on the carrier layer regions including filled vias therethrough coupled to the bond pads and to the metal post;
• forming a light blocking layer on sidewalls and on a bottom side of the substrate having a thermal conductivity at 20° C. of at least 10 W/m·K, and
• flipchip mounting a first device including a light emitter for emitting light at a wavelength having first bondable features to a first portion of the bond pads, wherein the flipchip mounting comprises forming a solder connection.

A method of forming a system in a package (SIP), comprising:

• providing carrier layer regions comprising a dielectric material with at least one metal post therethrough, adjacent ones of the carrier layer regions defining a gap having dimensions sufficient for placement of a driver integrated circuit (IC) die within the gap;
• positioning the driver IC die within the gap, the driver IC die comprising a substrate having circuitry configured for a function with nodes connected to bond pads exposed by openings in a top side of a first passivation layer, wherein the driver IC die is positioned with the bond pads facing up;
• forming a dielectric layer on the first passivation layer and on the carrier layer region including filled vias therethrough coupled to the bond pads and to the metal post;
• forming a light blocking layer on sidewalls and on a bottom side of the substrate;
• providing a first device including a light emitter for emitting light at a wavelength having first bondable features thereon;
• and
• connecting the first bondable features to the bond pads.

A method of forming a system in a package (SIP), comprising:

• providing a leadframe including a die pad and a plurality of leads or lead terminals, where the die pad and the leads or lead terminals are separated by a mold compound;
• placing a driver integrated circuit (IC) die on the die pad comprising a substrate having circuitry configured for a function with nodes connected to a plurality of bond pads including a first bond pad, wherein the driver IC die is positioned on the die pad with the plurality of bond pads facing up;
• placing a patterned redistribution layer (RDL) over a top side of the driver IC die;
• forming a mold compound on sides of the driver IC die having metal posts throughout its thickness attached to the leads or the lead terminals;
• wherein the RDL includes a first portion over the first bond pad, and traces between some of the plurality of bond pads and the metal posts;
• attaching a first device including a light emitter for emitting light at a wavelength to first bondable features on the first portion of the RDL;
• and
• wherein the RDL blocks at least 90% of the light that is incident thereon.