US 2022/0285280 A1 · INTEGRATED CIRCUITS (ICs) WITH MULTI-ROW COLUMNAR DIE INTERCONNECTS AND IC PACKAGES INCLUDING HIGH DENSITY DIE-TO-DIE (D2D) INTERCONNECTS

Abstract

An integrated circuit (IC) package including ICs with multi-row columnar die interconnects has increased die-to-die (D2D) interconnect density in a conductive layer. Positioning the die interconnects in die interconnect column clusters, that each include a plurality of die interconnect rows and two columns, reduces the linear dimension occupied by the die interconnects and leaves room for more D2D interconnects. A die interconnect column cluster pitch is a distance between columns of adjacent die interconnect column clusters and this distance is greater than a die interconnect pitch between columns within the column clusters. Die interconnects may be disposed in the space between the multi-row column clusters and additional die interconnects can be disposed at the D2D interconnect pitch between the die interconnect column clusters. IC packages with ICs including the multi-row columnar die interconnects have a greater number of D2D interconnects for better IC integration.

Claims24

Dependent claims

An integrated circuit (IC) die comprising:

a substrate;
a first die interconnect column cluster on the substrate, comprising:
a plurality of first die interconnect rows each comprising a first die interconnect spaced apart from a second die interconnect at a row die interconnect pitch;
and
a second die interconnect column cluster on the substrate, comprising:
a plurality of second die interconnect rows each comprising a first die interconnect spaced apart from a second die interconnect at the row die interconnect pitch;
wherein:
the second die interconnect in each first die interconnect row of the plurality of first die interconnect rows is adjacent to the first die interconnect in a second die interconnect row of the plurality of second die interconnect rows and is spaced apart from the first die interconnect in the second die interconnect row of the plurality of second die interconnect rows at a column cluster pitch greater than the row die interconnect pitch.

5 more elements

An integrated circuit (IC) package comprising:

a first IC;
and
a second IC;
wherein:
each of the first IC and the second IC further comprises:
a first die interconnect column cluster, comprising:
a plurality of first die interconnect rows each comprising a first die interconnect spaced apart from a second die interconnect at a row die interconnect pitch;
and
a second die interconnect column cluster, comprising:
a plurality of second die interconnect rows each comprising a first die interconnect spaced apart from a second die interconnect at the row die interconnect pitch;
and
the second die interconnect in each first die interconnect row of the plurality of first die interconnect rows is adjacent to the first die interconnect in a second die interconnect row of the plurality of second die interconnect rows and is spaced apart from the first die interconnect in the second die interconnect row of the plurality of second die interconnect rows by a column cluster pitch greater than the row die interconnect pitch.

9 more elements

Dependencies are inferred from the claim text.

INTEGRATED CIRCUITS (ICs) WITH MULTI-ROW COLUMNAR DIE INTERCONNECTS AND IC PACKAGES INCLUDING HIGH DENSITY DIE-TO-DIE (D2D) INTERCONNECTS

Life of this patent

INTEGRATED CIRCUITS (ICs) WITH MULTI-ROW COLUMNAR DIE INTERCONNECTS AND IC PACKAGES INCLUDING HIGH DENSITY DIE-TO-DIE (D2D) INTERCONNECTS

Life of this patent

Abstract

Claims24