Via structures having tapered profiles for embedded interconnect bridge substrates

A method of fabricating a package structure, the method comprising:

• forming one or more layers of dielectric material;
• embedding a substrate within the dielectric material;
• and
• forming one or more via structures each in direct contact with an external side of a corresponding pad of the embedded substrate on a first side of the embedded substrate, the external side facing away from the embedded substrate, wherein individual ones of the via structures comprise a conductive material and have a tapered profile, and wherein the individual ones of the via structures comprise a first portion and a second portion, wherein the first portion is on the embedded substrate, and the second portion is on the first portion, and wherein a lateral width of the first portion is greater than a lateral width of the second portion.

A method of fabricating a package structure, the method comprising:

• providing a substrate comprising one or more layers of dielectric material;
• embedding an interconnect bridge within the dielectric material;
• forming one or more first tapered interconnect structures each coupled to an external side of a corresponding pad of the embedded substrate on a first region of a first side of the embedded interconnect bridge;
• forming one or more second tapered interconnect structures each in direct contact with an external side of a corresponding pad of the embedded substrate on a second region of the first side of the embedded interconnect bridge, the external side facing away from the embedded interconnect bridge, wherein individual ones of the first and second tapered interconnect structures comprise a first portion and a second portion, wherein a lateral width of the first portion is at least about 10 percent greater than a lateral width of the second portion, and wherein the first portion is on the first side of the embedded interconnect bridge, and the second portion is on the first portion;
• providing a first die coupled to the one or more first tapered interconnect structures on the first region;
• and
• providing a second die coupled to the one or more second tapered interconnect structures on the second region.