US 2022/0285254 A1 · SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Abstract

A semiconductor device includes a semiconductor element and a lead part. The semiconductor element is mounted on a circuit pattern provided on an insulating substrate. The lead part has a plate shape and is bonded to the semiconductor element with a first bonding material interposed therebetween. The lead part includes a lead body and a bonding component. The lead body includes an opening part provided corresponding to a mounting position of the semiconductor element. The bonding component is provided in the opening part and on the semiconductor element. The bonding component is bonded at a lower surface thereof to the semiconductor element by the first bonding material and bonded at an outer peripheral part thereof to an inner periphery of the opening part by a second bonding material.

Claims13

Dependent claims

A semiconductor device comprising:

a semiconductor element mounted on a circuit pattern provided on an insulating substrate;
and
a lead part that has a plate shape and is bonded to the semiconductor element with a first bonding material interposed between the lead part and the semiconductor element, wherein
the lead part includes:
a lead body including an opening part provided corresponding to a mounting position of the semiconductor element;
and
a bonding component provided in the opening part and on the semiconductor element, and
the bonding component is bonded at a lower surface of the bonding component to the semiconductor element by the first bonding material and bonded at an outer peripheral part of the bonding component to an inner periphery of the opening part by a second bonding material.

5 more elements

A method for manufacturing a semiconductor device, comprising:

a step of preparing a semiconductor element mounted on a circuit pattern provided on an insulating substrate;
and
a step of bonding a lead part having a plate shape to the semiconductor element with a first bonding material interposed between the lead part and the semiconductor element, wherein
the step of bonding the lead part to the semiconductor element includes:
a step of placing the lead body including an opening part such that the opening part corresponds to a mounting position of the semiconductor element;
a step of placing a bonding component in the opening part and on the semiconductor element;
and
a step of heating the semiconductor element and the lead part to bond a lower surface of the bonding component to the semiconductor element by the first bonding material and to bond an outer peripheral part of the bonding component to an inner periphery of the opening part by a second bonding material.

5 more elements

Dependencies are inferred from the claim text.

Semiconductor device and method for manufacturing semiconductor device

Life of this patent

Semiconductor device and method for manufacturing semiconductor device

Life of this patent

Abstract

Claims13