Semiconductor package substrate and method of manufacturing the same, and semiconductor package and method of manufacturing the same

A method of manufacturing a semiconductor package substrate, the method comprising:

• preparing a base layer of a conductive material having a first surface and a second surface;
• forming a first groove or first trench in the first surface of the base layer;
• filling the first groove or first trench with a first resin;
• curing the first resin;
• removing a portion of the first resin that is exposed to the outside of the first groove or first trench and overfilled;
• forming a second groove or second trench in the second surface of the base layer to expose at least a portion of the first resin filled in the first groove or first trench;
• forming a third groove in the first surface of the base layer;
• and
• cutting the base layer along a cutting area passing through the center of the third groove, wherein a depth of the third groove is at least 1/2 of a thickness of the base layer.

A method of manufacturing a semiconductor package, the method comprising:

• preparing a base layer of a conductive material having a first surface and a second surface;
• forming a first groove or first trench in the first surface of the base layer;
• filling the first groove or first trench with a first resin;
• curing the first resin;
• removing a portion of the first resin that is exposed to the outside of the first groove or first trench and overfilled;
• forming a second groove or second trench in the second surface of the base layer to expose at least a portion of the first resin filled in the first groove or first trench;
• forming a third groove in the first surface of the base layer;
• mounting a semiconductor chip on a semiconductor package substrate;
• and
• cutting the semiconductor package substrate along the third groove,
• wherein a depth of the third groove is at least ½ of a thickness of the base layer.