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US 2022/0285245 A1Published application
Semiconductor module
AssigneesDenso Corporation, Toyota Jidosha Kabushiki Kaisha, MIRISE Technologies Corporation
InventorShohei NAGAI
Life of this patent
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Abstract
A semiconductor module includes a substrate, a semiconductor element and a heat sink plate. The substrate is included in a circuit board. The semiconductor element is disposed at the heat sink plate inside the substrate. A fluid is sealed inside the heat sink plate.
Claims7
A semiconductor module comprising:
- a substrate included in a circuit board;
- a semiconductor element configured to be disposed inside the substrate;
- and
- a heat sink plate at which the semiconductor element is disposed inside the substrate,
- wherein a fluid is sealed inside the heat sink plate.
2 more elements
Dependencies are inferred from the claim text.