Semiconductor device

Abstract

A semiconductor chip (2) is provided on an upper surface (1a) of a heat sink (1). A lead terminal (5,6) is electrically connected to the semiconductor chip (2), does not extend above a first side surface (1c) of the heat sink (1) but extends above a second side surface (1d) of the heat sink (1). Mold resin (10) covers the upper surface (1a), the first side surface (1c), and the second side surface (1d) of the heat sink (1), the semiconductor chip (2), and a part of the lead terminal (5,6). A lower surface (1b) of the heat sink (1) is exposed from the mold resin (10). An anchor structure (11) in which a lower portion of the first side surface (1c) of the heat sink (1) is recessed and is filled with the mold resin (10) is provided. The anchor structure (11) does not exist on the second side surface (1d) of the heat sink (1). The heat sink (1) does not protrude from a side surface (10a) of the mold resin (10).

Dependencies are inferred from the claim text.