Method of forming semiconductor packages having thermal through vias (ttv)
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSen-Kuei Hsu, Ching-Feng Yang, Hsin-Yu Pan, Kai-Chiang Wu, Yi-Che Chiang
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Abstract
A method of forming a semiconductor package includes the following steps. A redistribution layer structure is formed over a first die and a dummy die, wherein the redistribution layer structure is directly electrically connected to the first die. An insulating layer is formed, wherein the insulating layer is disposed opposite to the redistribution layer structure with respect to the first die. At least one thermal through via is formed in the insulating layer.
Claims20
A method of forming a semiconductor package, comprising:
- forming a redistribution layer structure over a first die and a dummy die, wherein the redistribution layer structure is directly electrically connected to the first die;
- forming an insulating layer, wherein the insulating layer is disposed opposite to the redistribution layer structure with respect to the first die;
- and
- forming at least one thermal through via in the insulating layer.
A method of forming a semiconductor package, comprising:
- forming a first die over a conductive paste;
- and
- forming at least one thermal through via over a first die, wherein the conductive paste is disposed between the first die and the at least one thermal through via, and the at least one thermal through via is electrically connected to the first die through the conductive paste.
A method of forming a semiconductor package, comprising:
- forming at least one first through via in an encapsulant;
- forming a redistribution layer structure over the at least one first through via;
- and
- forming at least one thermal through via over the redistribution layer structure and the encapsulant, wherein the redistribution layer structure is electrically connected to the at least one first through via and the at least one thermal through via.
Dependencies are inferred from the claim text.