Molded semiconductor package having a substrate with bevelled edge

A method of producing a molded semiconductor package, the method comprising:

• attaching a plurality of semiconductor dies to a first side of a leadframe;
• electrically interconnecting the plurality of semiconductor dies to form a power electronic circuit;
• attaching a substrate to a second side of the leadframe opposite the first side, the substrate comprising a metal body and an electrically insulative material that separates the metal body from the leadframe;
• and
• encapsulating the plurality of semiconductor dies in a molding compound,
• wherein the metal body comprises:
• a first surface in contact with the electrically insulative material;
• a second surface opposite the first surface and which is not covered by the molding compound;
• and
• a bevelled edge that extends between the first surface and the second surface,
• wherein the bevelled edge of the metal body has a first sloped side face that extends from the first surface to an apex of the bevelled edge, and a second sloped side face that extends from the apex to the second surface.

A method of batch producing molded semiconductor package substrates, the method comprising:

• forming an electrically insulative layer on a first main surface of a metal sheet;
• forming a plurality of intersecting V-shaped grooves in the first main surface of the metal sheet using a blade having sloped sidewalls;
• forming a plurality of intersecting V-shaped grooves in the second main surface of the metal sheet using the same or different blade having sloped sidewalls, the intersecting V-shaped grooves formed in the second main surface of the metal sheet being vertically aligned with the intersecting V-shaped grooves formed in the first main surface of the metal sheet;
• and
• singulating the molded semiconductor package substrates along the V-shaped grooves formed in the first main surface and the second main surface of the metal sheet such that each singulated molded semiconductor package substrate has a metal body and an electrically insulative material.