System and methods for controlling an amount of primer in a primer application gas
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorPei-Yi SU
Life of this patent
Estimating the term…
Abstract
A system for controlling an amount of primer in a primer application gas, includes a first sensor for detecting a first content in the primer application gas that is fed into a chamber containing a semiconductor wafer, a second sensor for detecting a second content in an exhaust gas that is exhausted from the chamber, and a flow control device that controls the amount of primer in the primer application gas based on a first sensor signal from the first sensor and a second sensor signal from the second sensor.
Claims20
A system for controlling an amount of primer in a primer application gas, comprising:
- a first sensor for detecting a first content in the primer application gas that is fed into a wafer priming chamber, wherein the wafer priming chamber is configured to receive a semiconductor wafer;
- a second sensor for detecting a second content in an exhaust gas that is exhausted from the wafer priming chamber;
- and
- a flow control device that controls the amount of primer in the primer application gas based on a first sensor signal from the first sensor and a second sensor signal from the second sensor.
A method of controlling an amount of primer in a primer application gas, comprising:
- detecting with a first sensor a first content in the primer application gas that is fed into a wafer priming chamber containing a semiconductor wafer;
- detecting with a second sensor a second content in an exhaust gas that is exhausted from the wafer priming chamber;
- and
- controlling the amount of primer in the primer application gas based on a first sensor signal from the first sensor and a second sensor signal from the second sensor.
An apparatus for processing a semiconductor wafer, comprising:
- a wafer priming chamber configured to receive the semiconductor wafer;
- a primer application gas line for supplying a primer application gas to the wafer priming chamber;
- an exhaust line for exhausting an exhaust gas from the wafer priming chamber;
- and
- a system for controlling an amount of primer in the primer application gas, comprising:
- a first sensor for detecting a first content in the primer application gas;
- a second sensor for detecting a second content in the exhaust gas;
- and
- a flow control device that controls the amount of primer in the primer application gas based on a first sensor signal from the first sensor and a second sensor signal from the second sensor.
Dependencies are inferred from the claim text.