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US 2022/0285201 A1Published application
Wafer assembly for mems fabrication
AssigneeMemjet Technology Limited
InventorsNicolas ARNAL, Troy Pasiola QUIMPO, Angus NORTH
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Abstract
A wafer assembly for use in a MEMS fabrication process. The wafer package includes: a MEMS wafer having a first side and an opposite second side; a silicone-free peel tape releasably attached to the first side of the wafer; a wafer bonding tape attached to the peel tape; and a carrier substrate releasably attached to the first wafer bonding tape.
Claims7
A wafer assembly for use in a MEMS fabrication process, the wafer package comprising:
- a MEMS wafer having a first side and an opposite second side;
- a silicone-free peel tape releasably attached to the first side of the wafer;
- a first wafer bonding tape attached to the peel tape;
- and
- a first carrier substrate releasably attached to the first wafer bonding tape.
2 more elements
Dependencies are inferred from the claim text.