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US 2022/0285200 A1Published application
Temporary protective film, reel body, packaging body, package body, temporary protective body, and method for producing semiconductor device
AssigneeShowa Denko Materials Co., Ltd.
InventorsTakahiro KURODA, Tomohiro NAGOYA, Naoki TOMORI
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Abstract
A temporary protective film including a support film and an adhesive layer provided on one surface or both surfaces of the support film. The support film is a polyimide film. The thickness of the adhesive layer is less than 8 μm.
Claims18
A temporary protective film comprising:
- a support film;
- and
- an adhesive layer provided on one surface or both surfaces of the support film,
- wherein the support film is a polyimide film, and
- a thickness of the adhesive layer is less than 8 μm.
2 more elements
Dependencies are inferred from the claim text.