US 2022/0285187 A1 · TREATMENT METHOD AND TREATMENT DEVICE FOR OOC ACTION DURING SEMICONDUCTOR PRODUCTION PROCESS

Abstract

A treatment method for an OOC action during a semiconductor production process includes: multiple Out Of Control Action Plan IDs (OCAPID) respectively corresponding to multiple semiconductor production process steps and multiple identified contents in one-to-one correspondence with the multiple OCAPIDs are established, and an OOC action checklist including multiple OOC action check items according to the identified contents is established; it is determined whether the OOC action occurs to a wafer subjected to the current semiconductor production process step, and if the OCC action occurs to the wafer, the current OCAPID corresponding to the current semiconductor production process step is automatically obtained, and the wafer is inspected according to the current identified content corresponding to the current OCAPID.

Claims20

Dependent claims

A treatment method for an Out Of Control (OOC) action during a semiconductor production process, the method comprising:

establishing a plurality of OCC Action Plan Identifications (OCAPIDs) respectively corresponding to a plurality of semiconductor production process steps and a plurality of identified contents in one-to-one correspondence with the plurality of OCAPIDs, and establishing an OOC action checklist comprising a plurality of OOC action check items according to the identified contents;
determining whether the OOC action occurs to a wafer subjected to a current semiconductor production process step, and if the OCC action occurs to the wafer, automatically obtaining a current OCAPID corresponding to the current semiconductor production process step;
and
inspecting the wafer according to a current identified content corresponding to the current OCAPID.

1 more element

A treatment device for an Out Of Control (OOC) action during a semiconductor production process, the device comprising:

a memory storing processor-executable instructions;
and
a processor configured to execute the stored processor-executable instructions to perform operations of:
establishing a plurality of OCC Action Plan Identifications (OCAPIDs) respectively corresponding to a plurality of semiconductor production process steps and a plurality of identified contents in one-to-one correspondence with the plurality of OCAPIDs, and establishing an OOC action checklist comprising a plurality of OOC action check items according to the identified contents;
determining whether the OOC action occurs to a wafer subjected to a current semiconductor production process step, and if the OCC action occurs to the wafer, automatically obtaining a current OCAPID corresponding to the current semiconductor production process step;
and
inspecting the wafer according to a current identified content corresponding to the current OCAPID.

4 more elements

Dependencies are inferred from the claim text.

Treatment method and treatment device for ooc action during semiconductor production process

Life of this patent

Treatment method and treatment device for ooc action during semiconductor production process

Life of this patent

Abstract

Claims20