Back to results
US 2022/0285140 A1Published application
Apparatus For Fiber Optic Temperature Probe In Processing Chambers
AssigneeApplied Materials, Inc.
InventorsMarcus Blake Freitas, David Masayuki Ishikawa, Vijay D. Parkhe, Visweswaren Sivaramakrishnan
Life of this patent
Estimating the term…
Abstract
Apparatus and systems for temperature probe integration on pedestal heaters of a processing chamber including a cooling assembly for cooling temperature probes disposed within. Cooling assemblies can be actively water-cooled, passively cooled by fin stacks. Further cooling assemblies include a mechanical arm assembly for lowering or raising the temperature probes.
Claims10
A substrate support comprising:
- a support top having a support surface and a bottom surface defining a thickness of the support body, and a thermal element within the thickness of the support body;
- a support bottom having a top surface and a bottom surface defining a thickness of the support bottom, the top surface positioned adjacent the bottom surface of the support top, and at least one opening extending through the thickness of the support bottom, the at least one opening configured to accept a temperature probe;
- and
- an active heat transfer component comprising at least one conduit extending around an outer surface of the support bottom, the at least one conduit having an inlet end and an outlet end and configured to provide a flow of heat transfer fluid.
1 more element
A substrate support comprising:
- a support top having a support surface and a bottom surface defining a thickness of the support body, and a thermal element within the thickness of the support body;
- a support bottom having a top surface and a bottom surface defining a thickness of the support bottom, the top surface positioned adjacent the bottom surface of the support top, and at least one opening extending through the thickness of the support bottom, the at least one opening configured to accept a temperature probe;
- and
- a passive heat transfer component comprising at least one heat transfer fin extending along the at least one opening in the support bottom, the passive heat transfer component having a channel to allow the temperature probe to pass through the support bottom.
1 more element
A substrate support comprising:
- a support top having a support surface and a bottom surface defining a thickness of the support body, and a thermal element within the thickness of the support body;
- a support bottom having a top surface and a bottom surface defining a thickness of the support bottom, the top surface positioned adjacent the bottom surface of the support top, and at least one opening extending through the thickness of the support bottom, the at least one opening configured to accept a temperature probe;
- and
- a sliding assembly comprising a base which slides rails in an upward or downward direction and a plurality of temperature probe protruding from the base.
1 more element
Dependencies are inferred from the claim text.