US 2022/0285137 A1 · PLASMA PROCESSING APPARATUS

Abstract

A plasma processing apparatus includes a substrate support having a substrate supporting portion on which a substrate is placed and a peripheral portion surrounding the substrate supporting portion, a conductive focus ring placed on the peripheral portion of the substrate support, a cover ring surrounding an outer periphery of the substrate support and formed of a dielectric material, a conductive ring placed on the cover ring, and a radio frequency power supply electrically coupled to the substrate support. A first surface on an outer peripheral portion of the focus ring and a second surface on an inner peripheral portion of the conductive ring are spaced apart from each other while facing each other. Further, the cover ring has a spacing portion that separates the focus ring from the conductive ring.

Claims20

Dependent claims

A plasma processing apparatus comprising:

a plasma processing chamber;
a substrate support disposed in the plasma processing chamber, the substrate support including a base and an electrostatic chuck disposed on the base;
at least one insulating ring disposed so as to surround the substrate support;
an inner conductive ring disposed on the electrostatic chuck and the at least one insulating ring so as to surround a substrate on the electrostatic chuck, the inner conductive ring having an outer side surface;
an outer conductive ring disposed on the at least one insulating ring so as to surround the inner conductive ring without contacting the inner conductive ring, the outer conductive ring having an inner side surface facing the outer side surface of the inner conductive ring;
a radio frequency power supply electrically coupled to the substrate support.

3 more elements

Dependencies are inferred from the claim text.

Plasma processing apparatus

Life of this patent

Plasma processing apparatus

Life of this patent

Abstract

Claims20