Coreless electronic substrates having embedded inductors

An apparatus, comprising:

• an electronic substrate, wherein the electronic substrate includes at least one inductor at least partially embedded therein, and wherein the at least one inductor comprises:
• at least one dielectric material layer;
• a first high-permeability magnetic ferrite element at least partially embedded in the at least one dielectric material layer;
• an inductor coil at least partially embedded in the first high-permeability magnetic ferrite element;
• and
• a second high-permeability magnetic ferrite element abutting the inductor coil and the first high-permeability magnetic ferrite element.

A system, comprising:

• an electronic board;
• and
• an integrated circuit package electrically attached to the electronic board, wherein the integrated circuit package, comprises:
• an electronic substrate having an inductor therein, wherein the inductor comprises a first high-permeability magnetic ferrite element, a second high-permeability magnetic ferrite element, and an inductor coil between the first high-permeability magnetic ferrite element and the second high-permeability magnetic ferrite element;
• and
• at least one integrated circuit die, wherein the at least one integrated circuit die is electrically attached to the package substrate.