Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same
AssigneeLG Chem, Ltd.
InventorsJeong Wook MUN, Kong Kyeom KIM, Woo Jae JEONG, Jee Hyeon HWNAG, Eun Byurl CHO, Jeong Hyuk AHN
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Abstract
The present disclosure provides an insulating layer for a multilayer printed circuit board, a multilayer printed circuit board including the same, and a method for fabricating the same. The insulating layer of the present disclosure includes a polymer resin layer containing a melamine derivative, and thus may have excellent adhesion to a patterned metal layer.
Claims15
An insulating layer for a multilayer printed circuit board, the insulating layer comprising a patterned polymer resin layer containing an alkali-soluble resin, a thermosetting binder, and a melamine derivative, wherein the melamine derivative has a structure of the following Chemical Formula 1:
- wherein A is an alkyl group containing 1 to 6 carboxyl groups, or an amine group containing 1 to 6 carboxyl groups.
Dependencies are inferred from the claim text.